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  • Tau Scaling Law & Logic Folding: Empyrean’s EDA Acquisition to Fill Digital Flow Gap

    On October 30, the 31st meeting of the Second Board of Directors of Empyrean Technology (301269) unanimously approved a proposal to acquire no more than 51% equity in its invested company, Easy-Logic Technology, for an investment not exceeding CNY 220 million. Upon completion of the transaction, Easy-Logic Technology will become a controlled subsidiary and be included in the consolidated financial statements. | Keyword: "Tau Scaling Law" The announcement explained the purpose of the investment w

    November 2, 2026

    Tau Scaling Law & Logic Folding: Empyrean’s EDA Acquisition to Fill Digital Flow Gap
  • RISC-V Industry Outlook: Ecosystem Fragmentation Risks and Differentiated AI Routes

    As an emerging computing standard system characterized by openness, controllability, prosperity, and innovation, the fifth-generation reduced instruction set (RISC-V) is standing at a historical turning point from ecosystem cultivation to large-scale commercialization. Amid profound changes in global geopolitics and economic landscapes, an increasing number of countries and regions are adopting it as an autonomous computing foundation for nurturing new industries. From an industrial practice per

    October 30, 2026

    RISC-V Industry Outlook: Ecosystem Fragmentation Risks and Differentiated AI Routes
  • GPNPU Startup VELOXIS AI Raises Funding to Build Edge Large-Model Inference Chip VLX-64

    Current computing power anxiety is not evenly distributed but exhibits significant structural differentiation. High-end training compute in the cloud remains tight, with advanced process nodes, HBM, and packaging capacity jointly constraining delivery. Meanwhile, although edge AI has gained considerable attention, stable, scalable, and profitable business loops remain scarce. More precisely, the industry is transitioning from "who can build a Demo" to a phase of differentiation where "who can ac

    October 30, 2026

    GPNPU Startup VELOXIS AI Raises Funding to Build Edge Large-Model Inference Chip VLX-64
  • Inston Technology Secures Series A Funding for Silicon Capacitor and Next-Gen MeRAM

    Recently, Suzhou Inston Technology Co., Ltd. (hereinafter referred to as "Inston Technology") announced the completion of its Series A financing round, with investors including Addor Capital, SIMIC Capital, and Oriza Holdings joining the round. The company, established less than three years ago, currently implements a "dual-track parallel" strategy: on one hand, it leverages high-performance silicon capacitors to rapidly enter the advanced packaging market for revenue generation; on the other ha

    October 30, 2026

    Inston Technology Secures Series A Funding for Silicon Capacitor and Next-Gen MeRAM
  • China IC Equipment Growth, Tight Tool Supply Test AI Chip Capacity Expansion

    Key Observation This Week: AI demand continues to drive capacity expansion at wafer fabs and equipment vendors, but the market is increasingly focusing on whether this expansion can be realized, if equipment supply can keep pace, and the return on AI investments. AI continues to drive investment in advanced logic, memory, testing, and packaging, but industry observation priorities are shifting from "how strong is the demand" to "how will the demand be realized": Can wafer fab expansion plans con

    October 28, 2026

    China IC Equipment Growth, Tight Tool Supply Test AI Chip Capacity Expansion
  • Roofline Theory Decoded: Ascend 950PR Hits 86% Utilization; AI Chip Competition Shifts from Peak Compute to Effective Compute

    In October 2026, a series of benchmarks on eight mainstream AI accelerator cards revealed that the Huawei Ascend 950PR achieved a median compute utilization rate of 86.0%, ranking first. While its absolute computing power was not leading, it utilized its own hardware most efficiently. This reflects a shift in the competitive logic of AI chips: beyond comparing peak computing power, the focus is now on who can truly utilize that power. Starting from the concept of the "Roofline," this article exp

    October 28, 2026

    Roofline Theory Decoded: Ascend 950PR Hits 86% Utilization; AI Chip Competition Shifts from Peak Compute to Effective Compute
  • Denlin Technology Passes HKEX Listing Hearing, Homegrown GPGPU for Enterprise AI

    Author | ZeR0 Editor | Moying Xindongxi reported on October 26 that yesterday, Jiangsu Suzhou-based General Purpose GPU (GPGPU) company Denlin Technology passed the listing hearing of the Hong Kong Stock Exchange. Founded in November 2017, Denlin Technology relies on its proprietary GPU chip architecture, the GPU+* (Minsky) architecture (which integrates GPGPU cores, AI acceleration units, and high-bandwidth on-chip memory subsystems into a single chip via intra-chip heterogeneity). The company

    October 27, 2026

    Denlin Technology Passes HKEX Listing Hearing, Homegrown GPGPU for Enterprise AI
  • Chinese AI Compute Chip Startups Grab Billions in Funding: PIM and Embodied AI Paths

    In October, the domestic AI compute chip sector witnessed a surge in funding activity. Several startups announced billion-yuan-level fundraising rounds, with distinct technological focuses. Beyond general-purpose computing, differentiated paths such as processing-in-memory (PIM) and embodied intelligence have also secured sustained capital investment. Huixi Technology Secures Over CNY 2.5 Billion in Cumulative Funding This Year, Pivoting to High-Compute Chips for Embodied Intelligence On October

    October 27, 2026

    Chinese AI Compute Chip Startups Grab Billions in Funding: PIM and Embodied AI Paths
  • AI ASIC Gains Momentum: Broadcom’s Multi-Billion Financing Deals for OpenAI and Anthropic

    Author: Junxi Broadcom is arranging over USD 50 billion in financing for custom AI chips for OpenAI, with negotiations still in the early stages. Less than a week ago, a financing arrangement of up to USD 42 billion between Anthropic and Broadcom was just disclosed to pay for TPU computing power leasing. Two leading model companies, one advancing in-house development and the other expanding the leasing of custom computing power, have both linked tens of billions of dollars in financial arrangeme

    October 23, 2026

    AI ASIC Gains Momentum: Broadcom’s Multi-Billion Financing Deals for OpenAI and Anthropic
  • Alibaba DAMO Unveils XuanTie RISC-V Roadmap for Autonomous Driving and Embodied AI

    On October 19, the 2026 RISC-V China Summit was held in Shenzhen. Meng Jianyi, Chief Scientist of DAMO Academy, delivered a keynote speech, introducing the latest progress of XuanTie RISC-V processors in architecture innovation, software compatibility, and ecosystem collaboration. Meanwhile, a processor product roadmap targeting autonomous driving and embodied AI was released, propelling XuanTie RISC-V into entirely new fields. Meng Jianyi pointed out, "For high-performance RISC-V to truly achie

    October 22, 2026

    Alibaba DAMO Unveils XuanTie RISC-V Roadmap for Autonomous Driving and Embodied AI
  • DF Compute DF1000: 3D Near-Memory AI Chip & 128-Card Cluster on Fully Domestic Supply Chain

    Author: Peng Cheng In October in Shanghai, at the first-ever "Guoxin Exhibition" held during the China International Industry Fair, many people took photos of three data cards at the DF Compute booth: the world's first verification of a 3D chip cluster system, completion of training adaptation for mainstream large models in 7 days, and running through the full chain of chip-software-cluster in 24 months. Viewed individually, each is a typical launch figure. Viewed together, the three figures poi

    October 22, 2026

    DF Compute DF1000: 3D Near-Memory AI Chip & 128-Card Cluster on Fully Domestic Supply Chain
  • Chery Launches Ziwei S Series SiC Chips: 8-inch Roadmap & Partners for High-Voltage EV Platforms

    On October 20, at the 2026 Chery Global Innovation Conference, Chery Automobile announced its strategic transition from a "traditional automaker" to an "AI-driven global intelligent technology company," and unveiled its self-developed automotive-grade chip brand—the Ziwei series, which includes SiC chips. Chery Automobile stated that its self-developed SiC chips are currently manufactured using 8-inch process technology, and next-generation products will adopt trench/super-junction processes. In

    October 22, 2026

    Chery Launches Ziwei S Series SiC Chips: 8-inch Roadmap & Partners for High-Voltage EV Platforms
  • RISC-V CPU for Intelligent Computing Centers: ZTE Microelectronics Unveils "Everest 200"!

    On October 19, the 6th RISC-V China Summit was held at the Shenzhen Convention and Exhibition Center. Leerui Micro, a subsidiary of ZTE Microelectronics, officially unveiled its first high-performance RISC-V CPU chip for intelligent computing centers, the "Everest 200". According to the materials released at the event, the Everest 200 features the following six major characteristics: Advanced RISC-V Architecture: Based on the latest RVA23 profile, it supports Hypervisor, AIA, CoVE, and RVV1.0 (V

    October 21, 2026

    RISC-V CPU for Intelligent Computing Centers: ZTE Microelectronics Unveils "Everest 200"!
  • XuanTie E908A: DAMO’s RISC-V automotive IP targets safety islands and zonal controllers

    On the afternoon of October 19, the RISC-V China Summit kicked off in Shenzhen. At this event, Alibaba DAMO Academy unveiled the XuanTie E908A, an automotive-grade enhanced processor, which is the first RISC-V CPU IP to simultaneously achieve ASIL-B and ASIL-D compliance. Many people immediately asked Vehicle: Does this mean Alibaba is going to make automotive chips? This article will not discuss how popular RISC-V is. Vehicle wrote about "New Opportunities for RISC-V in Automotive Electronics"

    October 21, 2026

    XuanTie E908A: DAMO’s RISC-V automotive IP targets safety islands and zonal controllers
  • RISC-V China Summit: DAMO Academy Updates XuanTie C950, Unveils Automotive & Embodied Intelligence Roadmap

    Author: Jiu Lin In 2018, a development board priced at USD 999 appeared on the hardware crowdfunding platform Crowd Supply. Named HiFive Unleashed, it was developed by the RISC-V chip company SiFive. The most prominent introduction on the project page was: the world's first RISC-V development board capable of running Linux. Looking back today, this selling point seems somewhat modest. However, for developers at the time, being able to get their hands on real hardware, run systems on it, and port

    October 20, 2026

    RISC-V China Summit: DAMO Academy Updates XuanTie C950, Unveils Automotive & Embodied Intelligence Roadmap
  • AgiBot Takes Strategic Stake in ChipV Intelligent, Deeply Partners on RISC-V Chips to Complete Underlying Computing Puzzle for Humanoid Robots

    Author: Zihao Recently, AgiBot, a leading enterprise in embodied AI, has made a strategic investment in ChipV Intelligent Technology, a Tsinghua-affiliated RISC-V AI chip company. In the current industry context, this investment is not merely a capital transaction between two companies, but rather a deep binding between a leading humanoid robot OEM and a domestic underlying computing power enterprise. It also positions ChipV Intelligent Technology, which has secured a foothold in both automotive

    October 19, 2026

    AgiBot Takes Strategic Stake in ChipV Intelligent, Deeply Partners on RISC-V Chips to Complete Underlying Computing Puzzle for Humanoid Robots
  • Giga Force Passes ChiNext IPO Review, Plans to Raise CNY 923.7M for Automotive Chip Testing and R&D Platform

    Recently, the official website of the Shenzhen Stock Exchange showed that Giga Force Electronics Co., Ltd. (hereinafter referred to as "Giga Force") successfully passed the ChiNext IPO review. It is reported that the company plans to use CNY 923,748,800 of the raised funds for this IPO, mainly for the Pudong Technology Center project, the automotive-grade high-reliability mass production test service construction project, the chip pilot scale-up platform engineering technology R&D project, a

    October 19, 2026

    Giga Force Passes ChiNext IPO Review, Plans to Raise CNY 923.7M for Automotive Chip Testing and R&D Platform
  • Stars Micro System Releases China’s First PCIe 6.0 Switch and 800G Multi-protocol AI NIC

    Author | Chen Junda Editor | Mo Ying The competition for AI computing power occurs not only within chips but also between them. No matter how high the peak computing power of a single chip is, it does not mean that a cluster composed of hundreds or thousands of chips can deliver corresponding performance. Whether data can be transmitted at high speeds and whether computing, storage, and networks can collaborate efficiently will both affect the actual performance of the entire system. As AI clust

    October 16, 2026

    Stars Micro System Releases China’s First PCIe 6.0 Switch and 800G Multi-protocol AI NIC
  • SUNMMIO Closes Pre-A2 and Series A Financing to Accelerate Mass Production of 3D TokenPU Chip A4E

    SUNMMIO, which focuses on the R&D and mass production of 3D architecture AI cloud high-computing-power chips, recently announced the completion of its Pre-A2 round (including its additional round) and Series A funding. The raised funds have three clear destinations: expanding top-tier R&D talent, increasing investment in core technology iteration, and accelerating the mass production and deployment of its self-developed 3D TokenPU large model computing power chip. All three point to the

    October 16, 2026

    SUNMMIO Closes Pre-A2 and Series A Financing to Accelerate Mass Production of 3D TokenPU Chip A4E
  • Lanxin LX500 Secures Over 200,000‑chip Orders; World’s First Mass‑produced RISC‑V+AI Server Comes to Reality

    On October 12, Lanxin Computing (Shenzhen) Technology Co., Ltd. completed its Series B financing, with a scale of nearly CNY 2 billion. Existing shareholders Shen Chuang Tou, Huakong Fund, and Longqiu Capital continued to increase their investments. New investors include local guidance funds such as Su Guotou and Yueke Finance, industrial capital such as GigaDevice Semiconductor, and institutions such as Taiping Kechuang, Jianyin International, and Jiukun Chuangtou. The company stated that the f

    October 15, 2026

    Lanxin LX500 Secures Over 200,000‑chip Orders; World’s First Mass‑produced RISC‑V+AI Server Comes to Reality

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